منابع مشابه
Development of Vertically Integrated Circuits for ILC Vertex Detectors
We report on studies of vertically interconnected electronics (3D) performed by the Fermilab pixel group over the past two years. These studies include exploration of interconnect technology, backside thinning and laser annealing, the production of the first 3D chip for particle physics, the VIP, and plans for a commercial two-tier 3D fabrication run. Studies of Direct bond Interconnect (DBI) o...
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Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arse...
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Competition between vertically integrated networks
Using the Laffont, Rey and Tirole (1998) framework, a model of competition between vertically integrated telecommunications networks in a deregulated environment is developed. Two local operators compete in linear and non linear tariffs (i.e. two-part tariffs) in the subscribers market. In addition, they are integrated downstream in a potentially competitive sector (i.e. long distance sector) w...
متن کاملFast Thermal Analysis of Vertically Integrated Circuits (3-d Ics) Using Power Blurring Method
CMOS VLSI technology has been facing various technical challenges as the feature sizes scales down. To overcome the challenges imposed by the shrink of the conventional on-chip interconnect system in IC chips, alternative interconnect technologies are being developed: one of them is three dimensional chips (3D ICs). Even though 3D IC technology is a promising solution for interconnect bottlenec...
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ژورنال
عنوان ژورنال: IEEE Transactions on Nuclear Science
سال: 2010
ISSN: 0018-9499,1558-1578
DOI: 10.1109/tns.2010.2049659