Vertically Integrated Circuits at Fermilab

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Development of Vertically Integrated Circuits for ILC Vertex Detectors

We report on studies of vertically interconnected electronics (3D) performed by the Fermilab pixel group over the past two years. These studies include exploration of interconnect technology, backside thinning and laser annealing, the production of the first 3D chip for particle physics, the VIP, and plans for a commercial two-tier 3D fabrication run. Studies of Direct bond Interconnect (DBI) o...

متن کامل

Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits.

Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arse...

متن کامل

Competition between vertically integrated networks

Using the Laffont, Rey and Tirole (1998) framework, a model of competition between vertically integrated telecommunications networks in a deregulated environment is developed. Two local operators compete in linear and non linear tariffs (i.e. two-part tariffs) in the subscribers market. In addition, they are integrated downstream in a potentially competitive sector (i.e. long distance sector) w...

متن کامل

Fast Thermal Analysis of Vertically Integrated Circuits (3-d Ics) Using Power Blurring Method

CMOS VLSI technology has been facing various technical challenges as the feature sizes scales down. To overcome the challenges imposed by the shrink of the conventional on-chip interconnect system in IC chips, alternative interconnect technologies are being developed: one of them is three dimensional chips (3D ICs). Even though 3D IC technology is a promising solution for interconnect bottlenec...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: IEEE Transactions on Nuclear Science

سال: 2010

ISSN: 0018-9499,1558-1578

DOI: 10.1109/tns.2010.2049659